Does anyone have any info quantifying board baking prior to reflow and wave soldering? Temps/ lengths of time @...? Also, does anyone have the scenario where a board is misprinted (solder paste), is sent thru a cleaner (in-line) and is then re-printed for placement. Do you re-bake and at what time/temp's? Thanks in advance! Lainie Loveless General Atronics Corp Wyndmoor, PA (215) 242-7336 ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################