Does anyone have any info quantifying board baking prior to reflow
and wave soldering?  Temps/ lengths of time @...?  Also, does anyone
have the scenario where a board is misprinted (solder paste), is sent
thru a cleaner (in-line) and is then re-printed for placement.  Do
you re-bake and at what time/temp's?

Thanks in advance!
Lainie Loveless
General Atronics Corp
Wyndmoor, PA
(215) 242-7336

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