We've got a few different RF surface mount components (amplifier, mixer ect.)that need to have the bottom surface of the component soldered directly to the ground plane of the surface mount board. This is necessary for proper electrical performance. The parts are packaged on tape & reel for pick & place assembly. The component leads are pretinned, but the bottom of the components are gold plated, approx 50 microinches. Two questions: 1. Can we get away without removing the gold from the bottom of the components? 2. What's the best way to pretin the bottom of the component, approx .5" square? ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################