Hi Everybody, I first circulated this message two weeks ago and was gratefull to receive some very helpfull replys. Perhaps there may be some new subscribers today that haven't seen this message before ? Let me first give a brief introduction. Working with a University based research group, it is part of my brief to undertake technology reviews from time-to-time. This effort is then supported by research activity which in turn helps support Irish Industry. My interest in electronic component heat transfer and in predicting operating junction temperatures over the last six years has now lead me closer to the area of electronic component/system reliability. In particular, we have identified a need to gain a better understanding for the different environments used to expose latent manufacturing defects within electronic systems during either the Burn-in or Thermal/Environmental Stress Screening (ESS) Process. These include high temperature burn-in, temperature cycling, power-cycling, combined power-on and temperature cycling, humidity testing, vibration testing and even altitude testing. While I have already accumulated many publications that describe the impact of specific component packaging and interconnection issues on Component Reliability, I find it difficult to trace recent Case Studies that describe the implementation of a burn-in or ESS programme. I would hope that such case studies might relate the type of failures exposed to the Environmental Test Conditions imposed, through to the type of Product under test . Therefore, I would greatly appreciate any helpwith this enquiry; whether it be contact names, relevant publications or case studies. Thanking you in advance, John Lohan. ==================================================== Dr. John Lohan Research Officer PEI Technologies Thermal Management Research Centre University of Limerick Ireland. Tel: +353-61-202449 Fax: +353-61-202393 Email: [log in to unmask] ==================================================== ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################