Hi Tuan, hi Pohkh, Assuming that the chip capacitors are o.k. to begin with, and that they are not damaged during placement, the cause is in all likelihood a combination of solder fillets that are too large and a cooling rate after reflow that is too fast. I would venture to bet, that in both of your cases you have soldering pads for these components that are large because they were originally designed for wave soldering. Solution is to make the width of the pads no wider than the components (that also reduces dombstoning) and to reduce the length of the pads protruding on either side--lengthwise--of the components. This will reduce the solder fillets considerably; for reflow soldering, there really is no need for the solder fillets from a reliability point of view. If reliability is an issue, glue the components to the board to get an increased solder joint height. Werner Engelmaier Engelmaier Associates, Inc. Electronic Packaging, Interconnection and Reliability Consulting 23 Gunther Street Mendham, NJ 07945 USA Phone & Fax: 973-543-2747 E-mail: [log in to unmask] ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################