Glad to help, James. The conference was very well attended--over 150 were there. This was the IPCs first effort at a conference to combine virtually all the board finishes. The emphasis was on new processes and sometimes sounded like a HASL bashing fest, but HASL was discussed also. Also, because some of these processes are still in the introductory phase, a few of the presentations sometimes had a "propietary" hint to them, and as could be expected, there was a bit a chest pounding on why their process was best. OK, a couple might have sounded a bit like sales engineers talking. However, the question/answer periods following each presentation were lively and gave lots of opportunity to steer the presenters back to global views. We are always attuned to the overall needs of our members needs, and obviously this kind of attendance shows the need additional presentations of this nature. We also recognize that the industry needs a few months to mature the processes and learn some lessons about things such as the BGA/gold interaction issue Dave Hillman responded to on the TechNet. Because of this, we will be waiting a short time, probably 6-8 months before we develop a follow-on conference. The good news is that the Proceedings (plus a supplement) have been reprinted and are available through IPC Customer Service. The cost is $50 for IPC members, $75 for non-members. Contact Customer Service at [log in to unmask] for additional information. Thanks for this opportunity to assist you. Jack Jack Crawford, IPC Project Manger - Assembly 2215 Sanders Road, Northbrook IL 60062-6135 [log in to unmask] http://www.ipc.org 847-509-9700 x 393 fax 847-509-9798 >>> <[log in to unmask]> 10/23/97 03:02AM >>> Hello Jack, I am interested in the information that Dave mentioned. Can you let me know how I can get this information? James Tan Materials Engineer Hewlett Packard Singapore Fax: (65) 268-4842 Tel: (65) 662-4412 email: [log in to unmask] Address: 2 Corporation Road, #05-01, Corporation Place Singapore 618494 ______________________________ Reply Separator _________________________________ Subject: Re: [TN] [TECHNET] Gold and BGA devices Author: Non-HP-ddhillma ([log in to unmask]) at HP-Singapore,mimegw19