HI TechNet - I am looking for some information. During the ANSIJ -STD-003
committee meeting last week the question came up about "At what feature
dimension do you increase your inspection magnification?" concerning the
solderability of plated thru holes and surfaces. In ANSIJ-STD-002 for
components the inspection magnification goes from 10x to 30x for 0.5mm
pitch (25 mil for those metrically impaired) and smaller. I believe that
the same principle is being used on solderability inspection for pwbs. Now
my question - at what feature size do you increase your inspection
magnification? Please email me your responses so the information can be
directed back into the 003 committee. I'll post the results on TechNet once
they are accumulated.

Dave Hillman
ANSIJ-STD-003 committee Chairman
[log in to unmask]

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################