Hi Dwayne, Why do you expect that a switch from HASL to gold immersion would improve the solder joint reliability of our 20mil components? I am not aware of anything in this switch that would affect solder joint reliability, with the exception that in case you plate too much Au you could get 'gold embrittlement' of the solder joints and therefore lower reliability. Perhaps you have some quality problems with your HASL process? But you did not mention them. Werner Engelmaier Engelmaier Associates, Inc. Electronic Packaging, Interconnection and Reliability Consulting 23 Gunther Street Mendham, NJ 07945 USA Phone & Fax: 973-543-2747 E-mail: [log in to unmask] ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################