Hi Steve, Sorry, but I did not see 'the att memo on PC card burnin' that you are referring to. Generally, however, a Burn-In on a populated PC card is a "generalized shack, rattle, and roll" that may show something for assemblies that have some manufacturing problems--for good assemblies a Burn-In should show nothing at all and can be discontinued for mature product with mature processing in place. Therefore, by its very nature there can be no such thing as 'experimental results', since the experience people have is highly specific to their product and production. The same can be said about 'times and temperature profiles' to be used in Burn-In; they should be essentially the most severe use conditions, perhaps in combination, for the product. Burn-In should not be confused with an Environmental Stress Screen--it is NOT an ESS! An effective ESS should be performed only on suspect product and needs to be carefully designed to stress the suspected latent defects to failure prior to shipping to a customer. Werner Engelmaier Engelmaier Associates, Inc. Electronic Packaging, Interconnection and Reliability Consulting 23 Gunther Street Mendham, NJ 07945 USA Phone & Fax: 973-543-2747 E-mail: [log in to unmask] ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################