Does anyone know of any design guides for chip-on-board parts to be used on FR4 material? What is minimum trace/spacing capabilities that fab shop can do with this process? What about pad sizes for wire bonds? Via sizes? Any help and/or where to go would be apprecicated. Larry L. Pucket Senior PCB Layout Designer Sandia National Laboratories P.O. Box 5800 MS-0624 Albuquerque, NM 87185-0624 Phone: (505)844-1711 Fax: (505)844-7428 Email: [log in to unmask] ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################