Hi, You wrote: Hello Technetters, A colleague and I have been facing some problems in Circuit testing with 2 types of boards that have OSP coating. There has been a low First time pass yield at approx 40% due to the thickness of the OSP coating, which we are specifying to the PCB manufacturers to be in the range of 0.2-0.25 um. The OSP coating is Entek Plus type 106 and the type of pin material used on these OSP boards are High conductivity steel made by QA technologies. The Incircuit tester used is HP 3070 series II with vaccum fixturing and the total pin count is 2004 pins on one board type and 1443 on another. Test time is approximately 1-2 minutes per board, and the failure if faused by poor pin contact will occur within the first 30 seconds of testing. We have been trying some alternative pin types ie. rotating flux buster type pins. Has any one out there used this pin type or any other that has increased the success rate on the FTPY? Does anyone have any suggestions on - alternative pin types and manufacturers - changes to the test fixturing to help resolve this problem - information on how to ensure while manufacturing these boards, osp coating proceses are controlled to get the right coating thickness. Thanks and regards Arjunan Murthy [log in to unmask] --------------------------------------------------------------------------- ------------------------------------------------------------- Have you already tried test probes made by Ingun ? My former employer used them without any big problems in IC- testing ( See http://www.cyberpoint.co.uk/ingun/ ) Boards were multilayer boards, 2-sided reflow, No-Clean flux, min via hole size 0.5 mm. No contact problems, occasionally probes were cleaned because of flux impurities. I have also heard that some companies design specific void pads on their pcb`s for testing purposes. those pads are then soldered in normal reflow process. Brs, Johannes