In response to the question of location: Solder balls are located on the side of the chip cap near either terminal land. The solder process is reflow only. Somponents on both sides exhibit the same problem. Other components such as DRAM has no solder balls. mike QA Materials Engineering Section Office: (919) 479-3771 FAX: (919) 479-3328 Internet: [log in to unmask] ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################