Mark, First off allow me to thank you for responding to my question! The populated glass epoxy boards are hand soldered. The measling occurs during rework, for the most part. A few boards have already been rejected for this condition. I'm trying to come up with a recommendation to our subcontractor for prevention of this problem including inert environment storage after baking. I'm leaning toward the 100 deg C for 6 hours schedule you mention in your response, since it makes sense to take it to the boiling point of water. My only concern is oxidation of the solder joints. Has anyone out there any experiance with this? Are there any documented references ie. IPC documents, MIL-STD's, which cite criteria for this problem? ---------- From: Mark W. Spitnale To: [log in to unmask] Subject: Re: [TECHNET] (TECHNET) Populated PWB's