Hi Technetters. One of the largest flexible PCB shop in Korea tried to laminate PI coverlay of one mil thick onto one mil/one ounce RA PI flexibles and floated them on a solder pot at 300 degree C for ten second. All the test coupons blistered. They claimed that Japanese coverlay withstands such condition, and asked us to improve the thermal resistance of the coverlay. I would like to be advised of your opinion on the test and its validity in real field. In other word, what do you see out of the 300 C test? Could you give me some light to lead persuade them into 288 C test ? Thanks and regards Myung C. Chu CSS Asia Co., Ltd. Tel: 82-2-523-8810 Fax: 82-2-523-1483 E-Mail: [log in to unmask]