We are presently using an Air-Vac system with good results. During my equipment evaluation, Air-Vac was able to remove a 1089 ceramic BGA, approximately 1.75" square, from a board which was bonded to a 1/8" silicon-carbide aluminum core without effecting surrounding components or components on the other side. Point is, heat wasn't a problem (it did take some time, though). The vision system and lighting works well, although white ceramic components have little contrast with the solder balls, making the alignment for these type devices more difficult. (fortunately, all of our BGAs use the brown ceramic packages) Feel free to call me if you'd like to discuss this further. Jim Marsico (516) 595-5879 [log in to unmask] ******************************** * ______ _ _ _____ * * / ___ | | | | | _____ * * / /___| | | | | | _____ * * __/ ____ | | | | |______ * * |____/ |_| |_| |________| * * * * SYSTEMS, INC. * ******************************** ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################