I am looking for companies that use pressure cooker methodologies to evaluate
oxide coatings of copper inner layer circuitry.   One of our overeas offices
recently asked if we could test this way, and I don't know what procedure to
follow.  I don't recall any IPC test for this, and wonder if it is derived
from an IEC or JEDEC oriented test.   If I understand correctly, the "cook"
is saturated humidity at 1.3 atmospheres (about 120 C) for up to two hours,
some room temperature equilabration period, and then solder float for 10
seconds.   Please reply where I can find the exact methodology.

Denny Fritz

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################