>Techneters: > I have recently experienced a hole wall pullaway issues on various > product. I completed a DOE using various dep chemistries and various > plating chemistries. The results were inconclusive. Is anyone aware of > a root cause for hole wall pullaway unrelated to the Electroless > process. Some possible causes: Thin plating is a factor as is outgassing in the laminate. It is more apparent on larger diameter holes as the barrel is more easily deformed. Think of the plating as a copper tube. The thinner the plating the weaker it is and more prone to deformation. The outgassing will apply pressure to the barrel and larger diameters are more easily deformed (eg a beer can). Make sure you have the right plating thickness and that the laminate is fully cured to prevent outgassing. If the pullaway is occurring after plating but before solder mask bake, you will find the bake will make a difference to outgassing and reduce or eliminate the problem. If none of the above is relevant and the pullaway is apparent in micro sections, but only evident on one side of the hole, then suspect the grinding technique used. Hope this helps Regards -- Paul Gould Teknacron Circuits Ltd [log in to unmask] Isle of Wight,UK