Hi Poh, No, dewetting can not be caused by component misalignment as such. However, if the misalignment occurs together with thin solder coating over copper and the solder paste somehow does not cover that area, than dewetting can occur. But, the real reason for the dewetting, which is likely a wetting problem rather than a de-wetting problem, is the thin HASL solder coverage. It is not a good idea to reduce the peak reflow temperatures or time at reflow temperatures (about 25C above Liquidus of the involved solder) to less than 5 seconds anywhere on the assembly. More product problems are created with inadequate wetting than with de-wetting. The solution is a thicker solder coat on the Cu surface (take it easy at HASL) or OSP. Werner Engelmaier Engelmaier Associates, Inc. Electronic Packaging, Interconnection and Reliability Consulting 23 Gunther Street Mendham, NJ 07945 USA Phone & Fax: 973-543-2747 E-mail: [log in to unmask]