[log in to unmask] wrote:
>
> Hello
>
> I would suspect a manfactuer's defect.  These parts should
> be able to handle the thermals of a through-the-wave process.
> It should take the heat from IR as well. However, check your temps.
> When I decap is use BOE Glass etchant(a hydrophloric).  A very
> nasty chemical.   If you use it be careful.  But it takes off the glass
> and preserves the silicon chip.  The other best way for F/A would
> be a visual examination.  Sometimes you can see the die attach.
> For visual:  lightly sand the glass to get a flat end for viewing.
> then examing with your microscope 50 to 100X+ should do
> the trick.
> %&&&&&&&&&&&&&&&&&&&&&&&&&&&%
>       Don F. Fumia
>       [log in to unmask]
>       Schneider Automation
>       No. Andover MA
> %&&&&&&&&&&&&&&&&&&&&&&&&&&&%THANK YOU!
GABY