[log in to unmask] wrote: > > Hello > > I would suspect a manfactuer's defect. These parts should > be able to handle the thermals of a through-the-wave process. > It should take the heat from IR as well. However, check your temps. > When I decap is use BOE Glass etchant(a hydrophloric). A very > nasty chemical. If you use it be careful. But it takes off the glass > and preserves the silicon chip. The other best way for F/A would > be a visual examination. Sometimes you can see the die attach. > For visual: lightly sand the glass to get a flat end for viewing. > then examing with your microscope 50 to 100X+ should do > the trick. > %&&&&&&&&&&&&&&&&&&&&&&&&&&&% > Don F. Fumia > [log in to unmask] > Schneider Automation > No. Andover MA > %&&&&&&&&&&&&&&&&&&&&&&&&&&&%THANK YOU! GABY