Hello Annie. We rep the ASI/coates mask and have gone up to 13 seconds on a moving solder without any cracks/deterioration. This was with one coat. A thick coat will protect it futher. You could have your supplier provide you with a scrap board and run the same test on your oven Afri On Thu, 14 Aug 1997, annie laberge wrote: > Regarding SMOBC, liquid photo, what would (in general) be the maximum > temperature and time a solder mask can hold before any deterioration occur > in a reflow oven? > > Same question but for PCB built with standard FR4 material, 6-8 > layers...what is the MAXIMUM temperature and time suggested in a reflow > oven for this type of PCB ? > > Thank you in advance > > ALaberge > > > At 02:03 PM 8/14/97 -0500, you wrote: > >John, > > > >Rather than looking for a different solder mask material you might want to > >change the board design to SMOBC (solder mask over bare copper). If > >you change to SMOBC, the tin could not reflow & therefore cause the > >solder mask to bubble & lift. > > > >>>> JOHN OSULLIVAN > ><[log in to unmask]> 08/14/97 > 04:49pm >>> > > REGARDING Solder mask material > > > >With regard to different solder mask material I'm interested in finding out if > >some solder mask materials have differnet thermal masking abilities. > >The reason I ask is because of a board I am wave soldering which has > >heavy > >copper layers internally, which forces me to pass the board through the > >preheat stage (and over wave) very slowly. The board was > >manufactured using > >all over tin/lead reflow. The tin/lead under the solder mask on large tracks > >are reflowing grosely and causing the soldermask to bubble/blister and > >crack > >off, failing the infamous 'tape test'. > > > >Any comments. > > > >Dennis Ostendorf > >aaeee2o @snds.com > > > > >