JOHN OSULLIVAN wrote: > > REGARDING Solder mask material > > With regard to different solder mask material I'm interested in > finding out if > some solder mask materials have differnet thermal masking abilities. > The reason I ask is because of a board I am wave soldering which has > heavy > copper layers internally, which forces me to pass the board through > the > preheat stage (and over wave) very slowly. The board was manufactured > using > all over tin/lead reflow. The tin/lead under the solder mask on large > tracks > are reflowing grosely and causing the soldermask to bubble/blister and > crack > off, failing the infamous 'tape test'. > > Any comments. I didn't know anybody still tried to put soldermask over reflowed traces. Soldermask over bare copper has been the norm (due to the reasons you detailed in your message) since before I was designing boards (8 years). -- Cap'n Jay the Red "In wildness is the preservation of the World" - Thoreau