You may find it difficult to plug/fill the via with LPISM. I have seen most people use a thermal ink to fill the via holes. Some do it before the LPI application ,while others will do so after regards afri On Thu, 31 Jul 1997 [log in to unmask] wrote: > Hello Technetters, > > Has anyone found a method to completely fill a via? I don't think > that the standard plating process will guarantee 100 % fill. We're also > looking at the option of screen printing conductive epoxy and trying to force > it through the hole. But, I don't have a lot of confidence in this process > either. The last option we're considering would be to plug the vias with LPI > soldermask. This seems like the best guarantee of fill. Thermal conductivity > is not so great, but it is better than air. > I'd sure appreciate any comments. > > Glenn Pelkey > Quality/Reliability Engineer > Maxtek Components Corp. > > *************************************************************************** > * TechNet mail list is provided as a service by IPC using SmartList v3.05 * > *************************************************************************** > * To subscribe/unsubscribe send a message <to: [log in to unmask]> * > * with <subject: subscribe/unsubscribe> and no text in the body. * > *************************************************************************** > * If you are having a problem with the IPC TechNet forum please contact * > * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * > *************************************************************************** > >