You may find it difficult to plug/fill the via with LPISM. I have seen most
people use a thermal ink to fill the via holes. Some do it before the LPI
application ,while others will do so after    regards  afri

On Thu, 31 Jul 1997 [log in to unmask] wrote:

> Hello Technetters,
>
>       Has anyone found a method to completely fill a via?  I don't think
> that the standard plating process will guarantee 100 % fill.  We're also
> looking at the option of screen printing conductive epoxy and trying to force
> it through the hole.  But, I don't have a lot of confidence in this process
> either.  The last option we're considering would be to plug the vias with LPI
> soldermask.  This seems like the best guarantee of fill.  Thermal conductivity
> is not so great, but it is better than air.
>       I'd sure appreciate any comments.
>
> Glenn Pelkey
> Quality/Reliability Engineer
> Maxtek Components Corp.
>
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