I will appreciate advice from anyone with experience soldering RF shielding cans onto boards by reflow soldering. We have a design that requires a continuous solder fillet between the board and the can and all internal seams on the can must be sealed. We are considering placing a bead of solder paste around the joints and sending the assembly, complete with the SMT installed, through the reflow oven. Our concern is that, due to unmatched CTE, the boards will warp and the solder joints between the can and the board will be under stress. Thanks in advance. ---------------------------------- Barry Allen, P. Eng. SED Systems Inc. Saskatoon, Saskatchewan, Canada Ph: 306-933-1646 Fx: 306-933-1486