Agree with your points - in general the best wire bondable Ni/Au surface is clean, rough but not too rough, and uncontaminated. I have no quantitative "roughness" information, unfortunately. Rob Schetty LeaRonal, Inc. ---------- From: TechNet Mail Forum on behalf of Paul Stolar Sent: Thursday, August 14, 1997 6:10 PM To: [log in to unmask] Subject: [TECHNET] Re[2]: [TECHNET] Finish for wirebond One more problem is the quality of the gold. I had more problems with 'shiny' gold. It is shiny because they add Hg to it. This plays havoc with wire bonding. I generally did not have problems bonding to smooth surfaces, assuming the gold was bonded to the nickel. That brings up another point, sometimes we saw contamination at the Ni-Au interface. ______________________________ Reply Separator _________________________________ Subject: Re: [TECHNET] Finish for wirebond Author: <[log in to unmask]> at internet