Hi All, Recently I heard of Solderability issue and lead fracture on fine picth QFP (16 mils or less) during vabiration test on the PWB with Electroless Nickle and Immersion Gold finish (100u-200u of Nickle and 3u-5u of gold) , couple reason was mention one being the flux used during the assembly and another was the Nickle passivation on the PWB before assembly. Is any of you have any experience with this problem and if you do, what you have done to correct the problem. Also I am interested on all the good things you can tell me about this finish type. Thanks. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************