I am trying to get some information on how to address and overcome the thermal concerns associated with secondary reflow of BGA sites during assembly. (Both IR and Wave used) Typically a secondary application of soldermask is applied to the vias connected to the BGA sites (bottom side) to act as a barrier to heat conduction. However the nature of the plugging operation (IPC indicated 95% plug capability is pretty standard). I am interested in any papers, studies or information which deals with the bare board requirements to avoid the potential reliability problems associated with secondary reflow. Thanks in advance, Karl Bornemann *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************