Hello Colleagues One of my favorite 'smaller-is-better' design Engineers found a Nanionics connector which uses 30 AGW wire for thru-hole leads, and recommends a thru hole diameter of 12-16 mils. (Tight tolerance, too, huh?) Question: Has anyone had problems with soldermask being left in these small holes. The alleged failure mode is from the LPI-developer not able to develop out soldermask in these holes, due their small diameter. This is reasonable, since LPI developing likes alot of impingement. I am looking for individuals who can commiserate, and who may have worked out an alternative. Other topic we could also talk about is holding a +/- .002 hole size with solder coating; HASL?; Plate and reflow?; Ni/ Immersion Gold? Finally, who in the Board industry told Nanionics this was an 'easy' thing to do? (just kidding) George Franck Raytheon E-Systems *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************