Hello Technet, I am interested in causes of low adhesion of plated copper to electroless copper other than low pre-plate microetch, Particularly... o Post development hold times o High humidity and temperature storage after development o Impact of development parameters (no step plating , some rough plating) Thank you in advance for sharing your experience in this area. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************