Andre, I've seen opens and shorts caused by the wave solder process reflowing BGA solder connections. When it happened the reaction plan was to immediately 100% inspect paste deposition, check the reflow profile, and to 100% x-ray after reflow. Because we didn't check the wave solder process, we allowed more defective boards to be built. I've also been told of occurrences where there were BGA connections becoming open on the package (but still soldered to the pad) on non functional BGA I/Os. The thought here is that the wave profile was pushing the edge and the joints that had no internal heat sinking were reflowing. At any rate, an IR temp gun was purchased to monitor the topside temperature at wave soldering. The target I believe is to be below 160 C. Hope this helps. ---------- From: Andre Bisson To: Technet Subject: Wave and BGA Date: Wednesday, July 16, 1997 10:00AM Hello all, I will like to have comment on any effect that a wave can do on a BGA. We have some boards with BGA on component side and many component on the solder side. Our process will be reflow component side, glue solder side, install all TH parts and go to wave. Is anyone had or have problems with BGA (solder joints problem) after wave? Our via's are half tented with solder masks and the trace connecting the via to the BGA pad is approx. 0.020"-0.030". My concerns are: - Re-reflow of BGA solder ball causing cold solder or any solder defect? - Reliability problems? - Etc. Any advice will be well appreciated. Thank you. Andre Bisson CAE Electronics [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************