Hi folks! Does anyone have a favorite formula for removing the molded plastic from around the IC and lead frame for failure analysis? Thanks in advance to all who reply... Best to all, J. Fjelstad ************************************************************************* _/_/_/_/ /__ __/ / ____/ / ___/ / ___/ / ___/ / __ / / \ _/_/_/_/ / / / /___ /___ / / __ / / _ \ _/_/_/_/ / / / __/ / / / / __/ / / \ \ / ___ \ _/_/_/_/ /_/ /_____/ /____/ /____/ /_____/ /_/ \_\ /_/ \_\ ...System Building Blocks for the Next Generation of Electronics 3099 Orchard Drive San Jose, CA 95134 Phone 408 894-0700 Fax 408 894-0768 *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************