Reply to: RE>ASSY - Water soluble solder pastes and component bake Bonjour Patrick, Please refer to J-STD-020 for baking of components that are moisture sensitive (after they have been exposed past their floor life). The component suppliers tend to specify the time and temperature for baking on each label. Humidity is absorbed / removed from a component at different rates. Hope this helps. Bonne chance. Charles Elliott NPI Process Engineering Newbridge Networks [log in to unmask] -------------------------------------- Date: 1997.07.30 10:55 AM To: Charles Elliott From: Patrick Ducas Does anybody have a specification for these particular topics : - Time allowed between water soluble paste printing and reflow ? - Time allowed between reflowed PCB assembled with waters soluble solder paste and the cleaning operation ? Is there a different specification between the different types or activity of organic fluxes? If it so, what is it? Is it a problem if we double reflow th PCB (double sided board) before the cleaning? Depending on the quantity of a giving lot, the time between the first printing and the cleaning operation may be long (see couple of hours, the cleaning machine is not in line with the SMT machines), that why I'm interested to know if there is a spec. Also, does anybody have a specification for the baking operation to prevent or eliminate moisture in plastic components (IC, QFP, BGA, etc...). Is there a relationship between the exposure time in humidity vs baking time or is there a fixed set of temperature and time parameters? Thanks in advance, it would be very appreciated if someone could share any specification or recommendation. ------------------------------------------------- Patrick Ducas Process Quality Engineer Matrox Electronic Systems Ltd E-mail: [log in to unmask] TŽl:(514)969-6000 ext.2971 Fax:(514)685-3415 ------------------------------------------------- *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * *************************************************************************** ------------------ RFC822 Header Follows ------------------ Received: by qmail.ca.newbridge.com with ADMIN;30 Jul 1997 10:51:52 -0400 Received: (from smap@localhost) by kanmaster.ca.newbridge.com (8.6.12/8.6.12) id KAA19760; Wed, 30 Jul 1997 10:51:06 -0400 Received: from kanata-gw.ca.newbridge.com(138.120.49.2) by kanmaster.ca.newbridge.com via smap (V1.3) id sma019405; Wed Jul 30 10:49:29 1997 Received: from ns.newbridge.com ([192.75.23.67]) by kanata-gw.ca.newbridge.com via smtpd (for kanmaster.ca.newbridge.com [138.120.124.4]) with SMTP; 30 Jul 1997 14:49:28 UT Received: (from smap@localhost) by ns.newbridge.com (8.6.12/8.6.12) id KAA13954; Wed, 30 Jul 1997 10:49:28 -0400 Received: from simon.ipc.org(209.42.29.3) by ns.newbridge.com via smap (V1.3) id sma013943; Wed Jul 30 10:49:08 1997 Received: from ipc.org by simon.ipc.org via SMTP (940816.SGI.8.6.9/940406.SGI) id JAA04235; Wed, 30 Jul 1997 09:38:42 -0700 Resent-Date: Wed, 30 Jul 1997 09:38:42 -0700 Received: by ipc.org (Smail3.1.28.1 #2) id m0wtZgn-000BkMC; Wed, 30 Jul 97 09:25 CDT Resent-Sender: [log in to unmask] Old-Return-Path: <[log in to unmask]> Message-Id: <[log in to unmask]> X-Sender: [log in to unmask] X-Mailer: Windows Eudora Light Version 3.0.1 (32) Date: Wed, 30 Jul 1997 10:34:50 -0400 To: [log in to unmask] From: Patrick Ducas <[log in to unmask]> Subject: ASSY - Water soluble solder pastes and component bake Mime-Version: 1.0 Content-Type: text/plain; charset="iso-8859-1" Content-Transfer-Encoding: quoted-printable Resent-Message-ID: <"FQI7R2.0.vcG.Dxqtp"@ipc> Resent-From: [log in to unmask] X-Mailing-List: <[log in to unmask]> archive/latest/14404 X-Loop: [log in to unmask] Precedence: list Resent-Sender: [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************