I agree with most of the advice given by other commenters regarding temporary solder masks. We see a number of cases each year, usually in conjunction with low solids (no-clean) fluxes, where electrical leakage and corrosion problems are traced back to residues from these latex materials. I would not use any of them with a no-clean process without extensive testing. The problem is usually the cure reaction and what outgasses from the mask during the curing. Our column in Circuits Assembly, December 1996, covered one such case study with problems associated with latex temporary masks. Doug Pauls CSL *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************