With finer lines and spaces, innerlayer cleanliness becomes more important. We've observed some innerlayer cleanliness issues on product that showed up after burn in of the assembly. All of the data I see being collected by board shops is for the final board cleanliness. At these shops, innerlayer cleanliness is controlled by how good the DES line is working but all the SPC data for that line relates directly to how well you develop, etch, strip not how clean the final product is at the end of the line. What are board shops and/or users of boards doing to ensure that they are getting product with good clean innerlayers? *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************