I am more familiar with test than board manufacture and would welcome an answer to a simple question. The quality of the connection depends on a number of characteristics of a reflow oven - pre-heat, temperature and time in the oven. CORRECT? If so, is there something I can attach to boards as they go through the system to ensure that the settings are correct for the particular boards? I am thinking of a substance that changes characteristics, say colour, at a rate depending on the temperature. We manufacture small quantities but large variety and thus the settings are potentially needing changing regularly. I want to eliminate faults before I have to test. I would normally ask the in-house expert but he is taking a well earned rest. Thanks in advance. Richard Philp, Test Technologist Matra BAe Dynamics *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************