Reply to: RE>Wave and BGA Bonjour Andre, This is a legitimate concern. The best way of finding out is to thermocouple the balls under the BGA and go through your wavesolder process. Also, keep in mind the potential for popcorning (delamination) if the BGA's are PBGA type. Hope this helps. Bonne chance. Charles Elliott NPI Process Engineering Newbridge Networks [log in to unmask] -------------------------------------- Date: 1997.07.16 11:22 AM To: Charles Elliott From: Andre Bisson Hello all, I will like to have comment on any effect that a wave can do on a BGA. We have some boards with BGA on component side and many component on the solder side. Our process will be reflow component side, glue solder side, install all TH parts and go to wave. Is anyone had or have problems with BGA (solder joints problem) after wave? Our via's are half tented with solder masks and the trace connecting the via to the BGA pad is approx. 0.020"-0.030". My concerns are: - Re-reflow of BGA solder ball causing cold solder or any solder defect? - Reliability problems? - Etc. Any advice will be well appreciated. Thank you. Andre Bisson CAE Electronics [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * *************************************************************************** ------------------ RFC822 Header Follows ------------------ Received: by qmail.ca.newbridge.com with ADMIN;16 Jul 1997 10:29:57 -0500 Received: (from smap@localhost) by kanmaster.ca.newbridge.com (8.6.12/8.6.12) id KAA15720; Wed, 16 Jul 1997 10:28:21 -0400 Received: from kanata-gw.ca.newbridge.com(138.120.49.2) by kanmaster.ca.newbridge.com via smap (V1.3) id sma015677; Wed Jul 16 10:28:16 1997 Received: from ns.newbridge.com ([192.75.23.67]) by kanata-gw.ca.newbridge.com via smtpd (for kanmaster.ca.newbridge.com [138.120.124.4]) with SMTP; 16 Jul 1997 14:28:16 UT Received: (from smap@localhost) by ns.newbridge.com (8.6.12/8.6.12) id KAA10057; Wed, 16 Jul 1997 10:28:15 -0400 Received: from simon.ipc.org(209.42.29.3) by ns.newbridge.com via smap (V1.3) id sma010000; Wed Jul 16 10:27:25 1997 Received: from ipc.org by simon.ipc.org via SMTP (940816.SGI.8.6.9/940406.SGI) id JAA05538; Wed, 16 Jul 1997 09:17:55 -0700 Resent-Date: Wed, 16 Jul 1997 09:17:55 -0700 Received: by ipc.org (Smail3.1.28.1 #2) id m0woUgV-000BkNC; Wed, 16 Jul 97 09:04 CDT Resent-Sender: [log in to unmask] Old-Return-Path: <[log in to unmask]> Message-Id: <[log in to unmask]> X-Mailer: Novell GroupWise 4.1 Date: Wed, 16 Jul 1997 10:00:07 -0300 From: Andre Bisson <[log in to unmask]> To: [log in to unmask] Subject: Wave and BGA Mime-Version: 1.0 Content-Type: text/plain Content-Disposition: inline Resent-Message-ID: <"I_u_72.0.JUE.HJDpp"@ipc> Resent-From: [log in to unmask] X-Mailing-List: <[log in to unmask]> archive/latest/14040 X-Loop: [log in to unmask] Precedence: list Resent-Sender: [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************