Gents, sorry about the 1st try which ended very abrupt. I`m trying to repeat what I was going to write: There has been a bunch of mails with respect to solder compatibility but to be honest I`m more confused than before. The initial question about mixing 63/37 tin-lead solder plating with 96.5/3.5 silver-tin wave solder process with respect to intermetallics produced some replies - but: 1. How do I manage to get rid of nearly all of the lead by a wave soldering pro- cess ? Anybody who can tell how much of the 63/37 solder is washed away ? While handsoldering I experienced that pretinning a 63/37 tin-lead solder plating with Sn96 - even if done more than once - will not result in a plain Sn96 finish. You will still find amounts of lead in the range of 0.6 - 5%. 2. What is the final solder composition if lead is still a part of it and what about the physical/mechanical properties ? Doesn`t 1% (or less) will decrease the melting point? Couldn`t be silver washed away ? And what about the mechanical pro- perties of whatever is the final composition of Sn/Pb/Ag with less than 3.5% silver? Christian *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************