Hello Fellow Internetters, I work for ERG telecommunications, in Perth, Australia. We have been seeing problems with the wave solder process,with two defect types ie. Bridging (approx 12%) and solder balling(Approx 2%). Bridging has the higher rate of the two problems. The location that the bridging problem occurs is mainly at the front of the boards as they pass the wave machine. Also bridging is mainly the trailing edge type but, there are instances when it bridges across the board.. The machine that is used, has the capability of spray and foam fluxing. Alternating between these two fluxing types, I observed that the foam fluxing gives better results, in most cases at 0% defect rate. My concern with changing to foam fluxing is that the residual contamination left after such a process is high( i am yet to test some boards with a Ionic contamination tester). The flux that is used is halide free Multicore X32-10i. Does anyone have any suggestions to reduce such wave solder problems ? Regards Arjun Murthy [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************