In a message dated 97-07-30 16:39:05 EDT, you write: > > 1. "Developing the Paste-in-hole Process", Tom Grevascio, Group > Technologies, Surface Mount International Proceedings, 1994 or > Circuit Assembly, Oct. 1995. > You might try Teresa Gentry at Circuits Assembly - her e-mail is [log in to unmask] > 2. "Through Hole Connector Soldering with Solder Paste Reflow", Bill > Barthel, Electronic Assembly Corp., Surface Mount International > Proceedings, 1994. > Bill Barthel, EAC, can be reached at 414-751-3651. Doug Pauls CSL *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************