Several years ago (10 to 15) a fellow named Roger Wild at the IBM Federal Systems Div. conducted a test to assess the effect of hole-fill (solder) on the reliability of plated through holes. As I recall the test consisted of subjecting pwb's with varying degrees of hole-fill to multiple thermal cycles and monitoring the failure rate during thermal cycling. Can anyone lead me to a source where I can get a copy of the report on this test. Thanks in Advance. Jim Moffitt *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************