In my opinion, both processes give the board a temperature extreme that is not a great idea. This is especially true when you have to go to a few reflows for surface mount comps. The best idea is not to reflow or hot solder dip. Go with an organic coating. Also, there is hot oil reflow, horizontal and vertical hasl, and other such operations which if not controlled for time, temp, etc. you can get a weak board. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************