I am looking for help on determining recommended dimensions for thermal vias and thermal via legs (spokes). I understand there is a trade-off between making the vias large enough with small enough legs to allow the board to be soldered without the use of a blast furnace versus making the vias smaller with larger legs to allow for the required current capacity of the connection. Any suggestions would be most appreciated. John Urry L3 Communications Salt Lake City, UT *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************