One of the more interesting factors that I have seen, that promotes peelers,
is the use of a dilute Sulfuric dip before acid Copper plating.  This is OK,
IF, the immersion time is short, and the acid changed often.

If either is not the case it can cause bad peelers, when the Copper in
solution builds up, and enough time is allowed for Cuprous salts to form,
which are nearly invisible, and when plated over will cause peelers.

Hope this helps.

Rudy Sedlak
RD Chemical Company

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************