I have just recently taken a job at a company primarily doing RF designs. I won't ask anything ridiculous like "How do I design for RF?" but I have two simple questions: In the past I have always called out "Soldercoat all exposed copper..." on the fab dwg, but here they are using tin plating. What is the difference between tin plate and soldercoat? Many of the RF designs here were done in AutoCAD, and the only reason I have been given for this was that it was easier to chamfer the corners of the delay lines (fairly wide 50 ohm traces on 20mil teflon). I may be wrongly assuming that the reason for the chamfer was to minimize the effect of the impedance change "around the corner", but my new CAD package can do curved traces which suggests NO mismatch around bends... constant width everywhere, right? Unfortunately, no one here has any data to support the need for chamfers. (I have to painstakingly enter precise polygons if chamfers are really required, so I would rather avoid it). We are working with 1.9GHz, and are moving to Rogers 4003 material. Can anyone with RF experience comment on this? in the dark.... jack, the new guy *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************