TechNet: We have been experiencing problems etching double-treat copper. Specifically, we have been leaving a fairly large foot at the base of the circuit. In addition to the obvious problems, this makes AOI very difficult due to the difference in reflective properties of the treated copper vs. bare copper at foot. If the speed is slowed enough to remove the foot, we generally over-etch the circuits. We use an ammoniacal etch and have also tried dipping the layers in a 10% HCl solution to break down the surface treatment prior to etch. Any suggestions would be appreciated. Thanks, John Lennox Process Engineer Eastern Manufacturing Corp. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************