I would like to take an informal survey of BGA pad design styles. 1. Are you using soldermask defined pads or pads that are clear of mask? (by soldermask defined pads I mean, the copper land is larger than the soldermask opening allowing the soldermask to define the BGA attachment site) 2. If you use Soldermask defined pads do you allow the soldermask to fall off the pad (misregistration)? If not how much registration do you allow for to keep the soldermask on the pad? 3. Do you experience problems with mask lifting during rework? Thanks for the help..looking forward to the discussion. Douglas Jeffery Electrotek,Inc. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************