Hi Steve, This has been a very common problem with ceramic LCCs on FR-4 PCBs, because of the large difference in CTE (coefficient of thermal expansion) between ceramic and FR-4 causes large thermal expansion mismatches during thermal cycling. If the LCCs are small (24 I/O or less) increasing the standoff height may be an adequate solution. For larger components you are likely need to go to leaded attachments with leads that are not too stiff. There are a number of analytical tools available (see IPC-D-279, 'Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies') to assure the reliability of your design. I provide this analysis for my clients. Werner Engelmaier Engelmaier Associates, Inc. Electronic Packaging, Interconnection and Reliability Consulting 23 Gunther Street Mendham, NJ 07945 USA Phone & Fax: 973-543-2747 E-mail: [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************