To: PCBfabnet; Technet
From: Westheimer-CTUA143 Scott on Wed, Jun 4, 1997 10:38 AM
Subject: FAB

We are currently using a peelable s/m to cover gold plated areas before HASL.
 The material is not always easy to remove and we would like to either look 
at alyernative processes or materials. Any suggestions?

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