To: PCBfabnet; Technet From: Westheimer-CTUA143 Scott on Wed, Jun 4, 1997 10:38 AM Subject: FAB We are currently using a peelable s/m to cover gold plated areas before HASL. The material is not always easy to remove and we would like to either look at alyernative processes or materials. Any suggestions? *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************