Hi all, I have a delima I need help with. Currently we "spotface" or mechanically remove resin from around our tooling holes after lamination before drilling to make the panels nice and flat and to remove surface resin. In doing this we create 2 problems: 1. For thinner laminations the amount of material removed may render the tooling hole unusable so we sand the resin and are not getting a complete removal or achieving flatness 2. The material exposed by the "milling" or "spotfacing" is rendered unplatable without going into a more aggressive desmear or etchback process that we do not normally run. This means that the electroless plating in these areas flakes off and we are forced to laminate dry film over these areas and use secoundary pinning for outerlayer registration. Question: Are there other alternatives to "spotfacing"? Especially for thinner laminations. Are there process steps I am missing that may solve one or both of these issues? Thanks, Doug Jeffery Electrotek, Inc. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************