The incompatibilities that I am aware of include:

1. During the fusing of the solder paste, flux will spread out onto the
surface of the solder mask and there will be a stain when the flux residues
are removed.

2. Solder balls will form on the surface of the solder mask after fusion of
the solder paste.

The best bet would be to check for compatibility between mask and solder
paste on unassembled boards.

Hope this helps

Larry Fisher
Dexter Electronic Materials
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