The incompatibilities that I am aware of include: 1. During the fusing of the solder paste, flux will spread out onto the surface of the solder mask and there will be a stain when the flux residues are removed. 2. Solder balls will form on the surface of the solder mask after fusion of the solder paste. The best bet would be to check for compatibility between mask and solder paste on unassembled boards. Hope this helps Larry Fisher Dexter Electronic Materials [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************