Marie-Josie: IPC-SM-786A indicates that, unless otherwise specified by the component manufacturer, bake the units shipped in high temperature shipping media for 24 hours at 125C. Units packed in shipping media which will not withstand these temperatures may be placed in an oven at 40C (+5/-0C) for 192 hours at <5% relative humidity. (It is critical that oven humidity be controlled at this low temperature.) The time required to desorb moisture down to the target level can vary from one week to a month depending on the starting moisture level and package thickness. Please keep in mind that the growth of oxides and lead finish intermetaalics are the main causes of lead finish degradation, which leads to poor solderbaility. These are thermally-activate processes. Therefore, limiting the time at 125C is curcial to maintaining good solderability. Also, take care to ensure that outgassing of the shipping and carrier media (e.g., trays) does not impact solderability. Verify use temperatures of carrier materials with the componen supplier before using the carriers in high temp applications. I believe Jedec specs call for similar treatment. Mike Buetow IPC Staff 2215 Sanders Road Northbrook, IL 60062 P: 847-509-9700, ext. 335 F: 847-509-9798 [log in to unmask] On Thu, 22 May 1997, Marie-Jose Lambert wrote: > Hello, > I would like to know if anyone has a baking procedure for components that have absorbed moisture (QFPs). We are thinking of baking them in an oven under vacuum or nitrogen but we are not sure for how long and at which temperature we would get the best results. > > Any information would be greatly appreciated. > > Thank you. > > Marie-Josée Lambert > B.Eng. > E-mail: [log in to unmask] > > *************************************************************************** > * TechNet mail list is provided as a service by IPC using SmartList v3.05 * > *************************************************************************** > * To subscribe/unsubscribe send a message <to: [log in to unmask]> * > * with <subject: subscribe/unsubscribe> and no text in the body. * > *************************************************************************** > * If you are having a problem with the IPC TechNet forum please contact * > * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * > *************************************************************************** > *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************