I am looking for some help on defining the differences between paste printing with stencil -vs- deposition (RPD) as it relates to how the paste performs in the oven. ie..slumping / oven profile differences. The main issues I am tring to over come are: 1 Volume of paste ie..needle dia. / on time valve 2 Hot slumping conditions because the board has an extremely high mass 250gms (multi-layer / heatsink plate) 3. The paste used is designed for deposition method This assembly uses standard pitch (.050") ceramic leadless chip carriers. Can not screen print because of HS. Thanks Wesley Samples Process Engineering Lead [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************